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dc.contributor.authorJayakumar, P.K.-
dc.contributor.authorBalasubramanian, K.-
dc.contributor.authorRabindranath Tagore, G.-
dc.date.accessioned2025-01-22T05:21:37Z-
dc.date.available2025-01-22T05:21:37Z-
dc.date.issued2012-03-
dc.identifier.citation10.1016/j.msea.2011.12.069en_US
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/2814-
dc.descriptionNITWen_US
dc.description.abstractThe structure, thermal stability and diffusion bonding behaviour of oxygen free high conductivity copper (OFHC), and Cu–Cr–Zr alloy (CRZ) with ultra fine grains (UFG) produced by severe plastic deformation through equal-channel angular pressing (ECAP) are investigated. Microstructural study reveals a grain refinement from 150 μm to 200 nm sized grains after 8 ECAP passes. Thermal stability of ECAP processed OFHC and CRZ has been investigated. Both OFHC and CRZ show hardness reduction at temperatures above 100 °C. However CRZ exhibits grain size stability up to a temperature of 500 °C. Diffusion bonding studies reveal that bond strengths of ∼54 MPa are developed between ECAP processed CRZ and OFHC at a lower temperature of 500 °C when compared to annealed materials.en_US
dc.language.isoenen_US
dc.publisherMaterials Science and Engineering: Aen_US
dc.subjectEqual channel angular processingen_US
dc.subjectCu–Cr–Zr alloyen_US
dc.subjectMicrostructureen_US
dc.subjectDiffusion bondingen_US
dc.titleRecrystallisation and bonding behaviour of ultra fine grained copper and Cu–Cr–Zr alloy using ECAPen_US
dc.typeArticleen_US
Appears in Collections:Mechanical Engineering

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