Please use this identifier to cite or link to this item: http://localhost:8080/xmlui/handle/123456789/2487
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dc.contributor.authorPradabane, Srinivasan-
dc.contributor.authorSrikanth, N.V.-
dc.contributor.authorNarasimharaju, B.L.-
dc.date.accessioned2025-01-06T11:24:18Z-
dc.date.available2025-01-06T11:24:18Z-
dc.date.issued2014-
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/2487-
dc.descriptionNITWen_US
dc.description.abstractThis paper investigates the rise in junction temperature in power semiconductor devices that occur due to the alternate Fixed-Bias Inverter SVPWM switching scheme for an open-end winding induction motor drive. The PWM scheme considered here uses only instantaneous phase reference voltages. The inverter losses are estimated for this drive system with this PWM strategy using an existing thermal model. The motor current is computed using d-q model of an open-end winding induction motor and the simulation study was performed using MATLAB/Simulink.en_US
dc.language.isoenen_US
dc.publisherInternational Review of Electrical Engineeringen_US
dc.subjectopen-end winding,en_US
dc.subjectspace vector modulationen_US
dc.titleInvestigation on Device Temperature in Open-end Winding Induction Motor Drive for Alternate FixedBias Inverter Schemeen_US
dc.typeArticleen_US
Appears in Collections:Electrical Engineering



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