Please use this identifier to cite or link to this item: http://localhost:8080/xmlui/handle/123456789/2195
Full metadata record
DC FieldValueLanguage
dc.contributor.authorKavicharan, M-
dc.contributor.authorMurthy, N.S.-
dc.contributor.authorBheema Rao, N.-
dc.date.accessioned2024-12-30T05:17:54Z-
dc.date.available2024-12-30T05:17:54Z-
dc.date.issued2014-
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/2195-
dc.descriptionNITWen_US
dc.description.abstractThis paper presents a novel, simple and accurate delay estimation model for single interconnect and tree interconnects, which is based on new matrix Pade-type approximant (MPTA). The proposed model provides a simpler rational function approximation for estimating delay and overshoot in lossy VLSI interconnects. Computational complexity is reduced by considering rational function denominator as scalar polynomial and avoiding matrix inversion. With the reduced order lossy interconnect transfer function, finite ramp responses are obtained and line delay and signal overshoot are estimated. The estimated delay and overshoot values are compared with the existing Pade model and HSPICE W-element model. Single interconnect 50% delay results are in good agreement with those of HSPICE within 0.5% error while the overshoot error is within 1% for a 1 mm long interconnects. For global lines of length more than 1 mm in SOC (system on chip) applications, the proposed model is found to be nearly two times more accurate than existing Pade model. Tree interconnects 50% delay values are also well agreeing with HSPICE and better than existing U-transform model. Furthermore the proposed model is computationally more efficient than HSPICE, Pade model and U-transform model.en_US
dc.language.isoenen_US
dc.publisherWSEAS Transactions on Circuits and Systemsen_US
dc.subjectmatrix rational modelen_US
dc.subjectRLC interconnectsen_US
dc.titleTransient Analysis of VLSI Tree Interconnects based on Matrix Pade Type Approximationen_US
dc.typeArticleen_US
Appears in Collections:Electronics and Communications Engineering

Files in This Item:
File Description SizeFormat 
CSCC.pdf522.74 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.