Please use this identifier to cite or link to this item: http://localhost:8080/xmlui/handle/123456789/1623
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dc.contributor.authorSawant, S.M-
dc.contributor.authorGururaja Rao, C-
dc.date.accessioned2024-11-21T08:29:23Z-
dc.date.available2024-11-21T08:29:23Z-
dc.date.issued2008-
dc.identifier.citation10.1007/s00231-008-0395-3en_US
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/1623-
dc.descriptionNITWen_US
dc.description.abstractThe problem of combined conduction-mixed convection-surface radiation from a vertical electronic board provided with three identical flush-mounted discrete heat sources is solved numerically. The cooling medium is air that is considered to be radiatively transparent. The governing equations for fluid flow and heat transfer are converted from primitive variable form to stream function-vorticity formulation. The equations, thus obtained, are normalised and then are converted into algebraic form using a finite volume based finite difference method. The resulting algebraic equations are then solved using Gauss–Seidel iterative method. An optimum grid system comprising 151 grids along the board and 111 grids across the board is chosen. The effects of various parameters, such as modified Richardson number, surface emissivity and thermal conductivity on temperature distribution along the board, maximum board temperature and relative contributions of mixed convection and radiation to heat dissipation are studied in detail. Further, the contributions of free and forced convection components of mixed convection to board temperature distribution and peak board temperature are brought out. The exclusive roles played by surface radiation and buoyancy in the present problem are clearly elucidated.en_US
dc.language.isoenen_US
dc.publisherHeat and Mass Transfer/Waerme- und Stoffuebertragungen_US
dc.subjectConjugateen_US
dc.subjectRadiationen_US
dc.subjectVertical electronicen_US
dc.subjectHeat sourcesen_US
dc.titleConjugate mixed convection with surface radiation from a vertical electronic board with multiple discrete heat sourcesen_US
dc.typeArticleen_US
Appears in Collections:Mechanical Engineering

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